Protecting electronics from moisture, vibrations, and mechanical stress is crucial for both functionality and longevity. At Electrotech, we offer advanced solutions in enclosure technology, combining innovative methods and materials to give your products proper protection and long durability.
Low pressure molding encapsulates electronics in a protective low-pressure mold. Sensitive components such as circuit boards, sensors, and wiring are protected without being exposed to extreme pressure or high temperatures. The result is a homogeneous, robust, and waterproof enclosure that can be customized to your exact specifications. The technology is ideal for products that need protection from moisture, chemicals, vibrations, and mechanical stress.
Plastic bending is a flexible method for creating customized enclosures in small and medium-sized series. The method offers fast lead times and low initial costs, while allowing the design to be adjusted without expensive molding tools. Plastic bending is often used for displays, terminals, and IP-rated enclosures, where both function and aesthetics can be optimized.
With extensive experience and expertise, we deliver encapsulation solutions that protect electronics in harsh conditions while optimizing production and design. Whether you need waterproof moldings, flexible plastic bends, or customized solutions for unique products, we can help you find the right method.
We ensure that each enclosure combines high quality, durability, and cost-effectiveness. Contact us for more information or to discuss which enclosure technology is best suited to your project.
